Introducing the 2uul BH40 Middle Layer BGA Reballing Stencil Platform Set, expertly designed for mid-layer BGA reballing on smartphone motherboards, specifically tailored for the iPhone 17 Series. This innovative tool ensures precise alignment and consistently reliable solder joints, making it an essential addition to your repair toolkit.

• Magnetic Stability: The integrated magnetic structure securely holds chips and stencils in place, preventing any displacement during heating and reflow processes.
• Efficient Workflow: Equipped with matched stencil support, this platform facilitates quick alignment and uniform solder ball planting, significantly enhancing your workflow efficiency.
• Durable Construction: Manufactured with premium-grade materials and precision machining, the BH40 offers exceptional durability, heat resistance, and a long service life, ensuring it withstands the demands of frequent use.
• Compact Design: Weighing only 44g, its lightweight and compact design allows for precise operation and easy handling, making it ideal for high-frequency repair tasks.

Compatibility: This stencil platform set is specifically designed for use with:

• iPhone 17 Pro
• iPhone 17 Pro Max
• iPhone Air
• iPhone 17

Each purchase includes:

• 1 x Positioning Plate
• 4 x Stencil

Upgrade your smartphone repair capabilities with the 2uul BH40 Middle Layer BGA Reballing Stencil Platform Set and experience the difference in precision and efficiency.